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封灌 表面披覆保护 密封 零件固定 芯片保护

中性, 单液型
Neutral cure; single component

不腐蚀电子零件及电路板铜线
Non-crossive to electronic components & wire

具有UV及RTV 双硬化效果, UV光无法照射的部分
也会室温自然硬化
Dual cure eliminates shadow effects on complex parts

适用于不规则形状之工件, 依形状形成垫片作为密封
UV硬化可在1秒即可内初步成形
UV cure @ 250 mW/cm2 < 1 second, no racking of parts
?
固化深度达到5/8"
Deep section cure up to 5/8”

可通过USP医疗认证
USP Class VI Compliant formulas available

不含溶剂, 低VOC
Solventless formulas; low VOC’s; % solids > 99%

耐高低温性能(-40° C to 200° C)
Service Temperature -40° F to 400° F (-40° C to 200° C)

可重工
Reworkable

Applications for Cybersil UV Encapsulants Series include potting, sealing and encapsulating various automotive, medical, electronics and industrial components.

Cybersil UV 800-200 UV封灌胶系列使用于灌注, 封装, 芯片保护, 绝缘及密封等, 有效的防水, 防震, 防尘, 气密, 防漏及绝缘等功能.
Cybersile 使用于汽车, 医疗,电子, 光学及一般工业.

电器绝缘
Electric Insulation

密封
Sealing

零件固定
Fixture

防潮保护
Moisture resistance

防震
Vibration Resistance

防水
Water proof

Packages 产品包装规格:

300ml cartridge

DUAL CURE
Dual cure products are formulated to react with both ultra violet light and atmospheric humidity. The cure mechanisms function independently of each other. Full properties are obtained after both cure mechanisms have been utilized.

The UV mechanism responds differently dependent upon the type of light source, the length of exposure to the light source and the distance from the light source. Cybersil UV Series products cure fully and rapidly in the 320 to 370 nm range. Peak absorption is 340 nm.

The moisture cure feature assures that the material cures successfully on complex parts where exposure to UV light is difficult or impossible to achieve. Similar to standard RTVs, the moisture component cure rates are dependent upon ambient temperature and humidity levels.