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Special Formulated for Difficult to bond Substrates.　
极困难接着材质用

Cyberbond Apllo H Series 专用于困难材质, 对大部分塑料,橡胶及金属材料具有极强之接着强度,并具有耐冲击及快速固定材质之特性. 接合后具有耐久性, 并可通过大部分电子产品环境测试, 以确保产品之质量及耐用性.

Cyberbond Apollo 以最新技术开发之 Neomer 瞬间接着剂 - 阿波罗H系列进一步突破各产业一直无法接着之低活化能表面材质, 并且不需要使用材质处理剂(Primerless)即可达高强度接着. 例如PP, POM, Silicone Rubber, TPU, TPR...

一般接着 General Bonding
零组件组装接着 Parts Assembly
电子组件组装 Electronic component assembly
机构组装 Structural Assembly
结构补强 Mechanic reinforce
接合点补强 Joint point reinforce
外壳组装 Case assembly

Apollo H2 Adhesive

Apollo H3 Adhesive

Apollo H4 Adhesive

Apollo H7 Adhesive

Apollo Hgel Adhesive

适合接着材质 Suitable substrates to bond:

热固性塑料, 热塑性橡胶, 合成橡胶, 硅橡胶, PC+ABS, ABS, PVC, Polycarbonate,TPR, TPU, PPS, PET, POM, EPDM, Mylar, Nylon, PBT, PP, 镁合金, 木材, 纸材, 皮革...等.